Vitrox (AXI)

DSS

VITROX_AXI

After 2009, Keysight Technologies (formerly known as Agilent Technologies) exited AOI & AXI business, Ellipsiz DSS (formerly known as iNETest Resources)  has been appointed as distributor for Vitrox AOI & AXI products for sales and support in Asia Pacific Region while continue to provide used Keysight 5DX and SJ50 solution from used market.

Our customers include world-leading EMS companies like Flextronics International, Celestica Inc, Jabil Circuit, Venture Corporation, Foxconn and OEM/ODM companies including Cisco, Intel, Quanta Computer, Asustek Computer, Wistron Corporation, Compal Electronics.


Vitrox latest innovation in 3D In-Line Advanced X-ray Inspection System (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.

3D In-Line Advanced X-ray Inspection System (AXI)

  • Able to Inspect Various Advanced Packages, such as heavily shaded
  • high-speed package, multi-stacked POP, micro packages, GBx-T and pin-in-paste
  • Press Fit Depth/Bent Inspection Capability (with PSP 2 feature)
  • Single Unified Management Office
  • Scan Path Merging
  • Virtual Live 2
  • Board z-offset
  • Pin-Through-Hole (PTH) Wetting Coverage
  • Head-in-Pillow (HIP) Inspection Capability
  • Global Surface Modeling (GSM)
  • Patented Phase Shift Profilometry (PSP)
  • Variable Magnification (VM)
  • Digital Tomosynthesis Methodology

  • Able to Inspect Various Advanced Packages, such as heavily shaded  high-speed package, multi-stacked POP, micro packages, GBx-T and pin-in-paste
  • Press Fit Depth/Bent Inspection Capability (with PSP 2 feature)
  • Single Unified Management Office
  • Scan Path Merging
  • Virtual Live 2
  • Board z-offset
  • Pin-Through-Hole (PTH) Wetting Coverage
  • Head-in-Pillow (HIP) Inspection Capability
  • Global Surface Modeling (GSM)
  • Patented Phase Shift Profilometry (PSP)
  • Variable Magnification (VM)
  • Digital Tomosynthesis Methodology

  • Able to Inspect Various Advanced Packages, such as heavily shaded
  • high-speed package, multi-stacked POP, micro packages, GBx-T and pin-in-paste
  • Press Fit Depth/Bent Inspection Capability (with PSP feature)
  • Floodfill Inspection Method for Void Defect
  • Pin-Through-Hole (PTH) Wetting Coverage
  • Head-in-Pillow (HIP) Inspection Capability
  • Global Surface Modeling (GSM)
  • Patented Phase Shift Profilometry (PSP 2)
  • Variable Magnification (VM)
  • Digital Tomosynthesis Methodology

For more information, please feel free to drop us an email at info@ellipsiz.com

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