RF plasma allows the low-temperature modification of a wide range of specimens and substrates. Plasma etching is generally confined to the semiconductor industry, typically for the removal of silicon layers using reactive gases, such as CF4 and for the removal of Photoresist using oxygen.
Plasma ashing refers to the controlled, low-temperature removal of organic material using oxygen or air and has applications across many areas of research and quality control. RF plasma can also be used for the surface modification of plastics and polymers, and for cleaning TEM and SEM specimens and specimen holders.
The K1050X Plasma Etcher/Asher/Cleaner is a compact, bench-top system designed for research and development, and some small scale production applications.
Many of our instruments require the addition of a suitable two-stage rotary vacuum pump (vane pump), either as a primary pump or to ‘back’ built-in turbomolecular pumps.
We are pleased to offer the Pfeiffer DUO 6 two-stage pump, which has an excellent reputation for both reliability and performance, delivering high or low throughputs with high ultimate vacuum. In addition, their low mass and size, coupled with ultra-low noise and vibration levels makes the DUO 6 ideally suited to Quorum Technologies bench-top coaters, cryo-SEM preparation systems and other instruments.