Digit Concept

Digit Concept has been supplying tools for semiconductor Failure Analysis since 1992. With over 20 years of experience in IC decapsulation, we truly understand the needs of our customers and with our international team of experts, Digit Concept have become the leader in decapsulation.

Digi Concept invests a considerable amount of time and effort in understanding the actual needs for today’s decapsulations of IC packages and the needs of the future, hence we are constantly involved in the development of new and innovative techniques for the semiconductor industry. Being a fabless company allows us to focus on the techniques of decapsulation, developing the equipment necessary for the task through collaboration with the leading manufacturers in each of the 4 ways of decapsulation.

  • SESAMEAcid
    SESAMEAcid
  • SESAMELaser
    SESAMELaser
  • SESAMEMechanical
    SESAMEMechanical
  • SESAMEPlasma
    SESAMEPlasma


 

 

 

Product
Product Model
Specification
Options
SA700DC
  • Negative Pressure System
  • Compatible with HNO3, H2SO4, HNO3/KI+I2 mixture and other acids or mixture
  • Ready for Al, Au, Cu, Cu/Pd, Ag wires
  • Etching temperature from ambient to 100°C
  • Acid Safe: low risk, no acid projection with the negative Pressure
  • Easy control of the opening during operation
  • The Best Quality/Price ratio in the market
  • Compatible with standard gasket
  • Easy to use with the IPanelTM and intuitive software
  • Fast colling
  • Bias for bonding detection and more ...
  • Operation traceability and Program memory
  • PCB and SmartCard Etching Head available
SA777 The first acid decapsulator made for copper... but not only. The SA777 is an Automated Mixed Acid Decapsulator based on SA707, with advanced feature integration to enable high productivity. This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.
SA777UG
  • Up Grade of your Integrated Etcher Unit
  • Compatible with Nitric Acid / Sulfuric Acid / Mixed Acid / Ki+I2 Nitric Acid
  • Improved Pressure Sensor System
  • New Nozzle Detector Module
  • 3 bottles of 500ml: 2 acids & 1 waste
  • Improved Electronic Control Unit
  • iPanel user interface - IP67 protective box -  Tempered glass screen protector
  • Intuitive Software
  • Bonding Detection by Acid Polarization
  • New Fast cooling
  • ew DC Pump (5 years warranty)
  • 1 or 2.5 Liter's bottles
  • Fixed Etch Head for a better thermal transfer

SESAME Laser

After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).
The SLP500DC is based on our SL500DC platform.  It combines a high performance IR Fiber LASER with an Atmospheric Plasma Assisted to avoid corrosion.This SLP is based on our joint patent with the CNES Toulouse (Fr) – WO 2008/090281.

Product
Product Model
Specification
Options
  • 3 in 1 system:IC decapsulator, PCB cutting, Cross-section
  • Flexible and Reliable
  • Easy and Safe
  • SLP500DC
    • Laser ablation area up to 170x170mm with the 254mm lens
    • Atmospheric Plasma AssistedTM to avoid corrosion (*1)
    • Compatible with Au, Al, Cu, Cu/Pd, Ag wires
    • Quick focus with its lateral camera
    • Real time vision during ablation
    • Wide choice of FOV
    • Easy to use with its 2 intuitive software: Basic and Expert
    • Precise decapsulation using Xray and SAM images
    • Design your own gasket
    • Small footprint and easy to move
    • Fast upgrade on site
    • LASER Cross-Section
    • Through Galvo-Head Camera
    • Cooler blast and cold table to reduce impact of temperature elevation of the die, fix the package and reduce ESD
    • Programmable X-Y table : 50x50mm or 100x100mm
  • True 3 in 1 system : IC decapsulator, PCB cutting, samples cross-section
  • Flexible and Reliable
  • Easy and Safe
  • SLP 500DC+
    • IC decapsulation, PCB cutting, ICs cross sections
    • Laser ablation area up to 170x170mm with the 254mm lens
    • Atmospheric Plasma AssistedTM to avoid corrosion (*1)
    • Compatible with Au, Al, Cu, Cu/Pd, Ag wires
    • Quick focus with its lateral camera
    • Real time vision during ablation
    • Wide choice of FOV
    • Easy to use with its 2 intuitive software: Basic and Expert
    • Precise decapsulation using Xray and SAM images
    • Design your own gasket
    • Small footprint and easy to move
    • Fast upgrade on site
    • Through Galvo-Head Camera
    • Cooler blast and cold table to reduce impact of temperature elevation of the die, fix the package and reduce ESD
    • Cooler blast and cold table to reduce impact of temperature elevation of the die, fix the package and reduce ESD
    • Programmable X-Y table : 50x50mm or 100x100mm

    Get the benefit of all the capabilities of our 20W Fiber LASER with the space available in the chamber

    SLP1000DC
    • New Fiber LASER for decapsulation - Ytterbium doped Fiber 1064nm air cooled - Ready for IC and PCB cross sections
    • Atmospheric PLASMA Assisted (Patented)
    • 254mm Lens with a marking area of 170x170mm - Less damage to the wires 
    • Real time vision of the decapsulation - side camera - no need to move the sample
    • High density LED for lightening
    • Easy Focus thanks to a side camera and a pointer LASER
    • Z Axis programmable
    • Fast calibration to maintain system accuracy
    • High grade Manual Precision XY table in standard: 100 x 100mm
    • More than 10 years of recipes are delivered on 200+ SesameLASER
    • Coaxial camera through Galvo-Head for a real view of your job
    • High resolution camera
    • Cooler gun to improve cross section
    • X and/or Y programmable axes

     

    SESAME Mechanical

    Product
    Product Model
    Specification
    Options
    SM410UG
    • Upgrade of your Mechanical Preparation Unit
    • Improved XY table
    • New milling capabilities
    • Quick and Fast settings
    • Improved Electronic Control Unit
    • iPanel user interface with an intuitive software
    • The Best Quality/Price ratio in the market
    • Compatible with standard gasket
    • Easy to use with the IPanelTM and intuitive software
    • New motorised Z axis
    • Improved Tilt adjust
    • Automated Z milling control
    • Video live view
  • Foot print: 200 x 80 x 125mm
  • Weight: 2 kg
  • SM441DC
    • Upgrade of your Mechanical Preparation Unit
    • Improved XY table
    • New milling capabilities
    • Quick and Fast settings
    • Improved Electronic Control Unit
    • iPanel user interface with an intuitive software
    • The Best Quality/Price ratio in the market
    • Compatible with standard gasket
    • Compatible with TO204, TO3, ... packages
    • Simple, safe and economic
    • No damage to internal wires


    SESAME Plasma

    Product
    Product Model
    Specification
    Options
    SESAME Plasma Cleaning
    • All types of Plasma Cleaning
    SESAME Plasma Decapsulation
    • First and only qualified system to interface with patented laser decapsulation technology

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