Digit Concept has been supplying tools for semiconductor Failure Analysis since 1992. With over 20 years of experience in IC decapsulation, we truly understand the needs of our customers and with our international team of experts, Digit Concept have become the leader in decapsulation.
Digi Concept invests a considerable amount of time and effort in understanding the actual needs for today’s decapsulations of IC packages and the needs of the future, hence we are constantly involved in the development of new and innovative techniques for the semiconductor industry. Being a fabless company allows us to focus on the techniques of decapsulation, developing the equipment necessary for the task through collaboration with the leading manufacturers in each of the 4 ways of decapsulation.[huge_it_slider id=”1″]
After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).
The SLP500DC is based on our SL500DC platform. It combines a high performance IR Fiber LASER with an Atmospheric Plasma Assisted to avoid corrosion.This SLP is based on our joint patent with the CNES Toulouse (Fr) – WO 2008/090281.